{"id":3695,"date":"2026-08-03T05:17:35","date_gmt":"2026-08-03T13:17:35","guid":{"rendered":"https:\/\/roadlinktraffic.com\/?page_id=3695"},"modified":"2026-08-29T03:49:50","modified_gmt":"2026-08-29T11:49:50","slug":"applications","status":"publish","type":"page","link":"https:\/\/roadlinktraffic.com\/fr\/applications\/","title":{"rendered":"Applications du processus d'assemblage de PCB"},"content":{"rendered":"\n
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Find SMT Equipment by Production Problem<\/h1>\n\n\n\n
Dust before printing, blocked stencil apertures, unstable nozzle pickup, inconsistent THT soldering, flux residue and hidden BGA defects require different equipment and processes.<\/div>\n\n\n\n
Explore the production stage where the problem occurs, understand the available process and compare the relevant DEZ SMT equipment.<\/div>\n\n\n\n
\nContact an Application Engineer<\/a>\n<\/div>\n<\/div>\n <\/div><\/div>\n\n\n\n
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Explore Applications by Process Stage<\/h2>\n<\/div>\n <\/div><\/div>\n\n\n\n
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\"PCB<\/a><\/div>\n\n\n\n
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PCB Surface Cleaning Before Printing<\/h5>\n\n\n\n
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Dust, fibres and static-attracted particles on bare PCBs can enter the solder paste printing process. Double-sided PCB cleaning removes loose contamination before the board reaches the printer.<\/div>\n<\/div>\n\n\n\n
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\"Solder<\/a><\/div>\n\n\n\n
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Solder Paste Stencil Cleaning<\/h5>\n\n\n\n
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Solder paste, red glue and flux can dry inside stencil apertures and affect paste transfer. Pneumatic and water-based cleaning processes remove compatible residue from SMT stencils and screen mesh.<\/div>\n<\/div>\n\n\n\n
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\"SMT-Nozzle-Cleaning-&-Placement-Accuracy\"<\/a><\/div>\n\n\n\n
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SMT Nozzle Cleaning and Maintenance<\/h5>\n\n\n\n
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Dust and adhesive inside placement nozzles reduce vacuum pickup force and can cause mispicks or dropped components. Automatic nozzle cleaning removes contamination from the nozzle air path.<\/div>\n<\/div>\n\n\n\n
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\"SMT<\/a><\/div>\n\n\n\n
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SMT Line Handling, Buffering and Transfer<\/h5>\n\n\n\n
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PCB loaders, unloaders, conveyors and buffers control board movement between SMT processes. Equipment selection depends on PCB dimensions, line height, direction, takt time and required buffer capacity.<\/div>\n<\/div>\n\n\n\n
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\"Selective<\/a><\/div>\n\n\n\n
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Selective Soldering Optimization<\/h5>\n\n\n\n
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Connectors, terminals, relays and other THT components may require soldering without exposing the entire assembly to a conventional solder wave. Selective soldering controls flux application, preheating and mini-wave soldering at programmed joints.<\/div>\n<\/div>\n\n\n\n
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\"PCBA<\/a><\/div>\n\n\n\n
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PCBA Flux and Ionic Contamination Cleaning<\/h5>\n\n\n\n
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Compatible flux and ionic residue can remain after soldering. Brush, batch and inline cleaning processes are available according to the accessible board surface, contamination, production volume and required rinse process.<\/div>\n<\/div>\n\n\n\n
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\"X-Ray<\/a><\/div>\n\n\n\n
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X-Ray Inspection and BGA Rework<\/h5>\n\n\n\n
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X-ray inspection detects voids, bridges, insufficient solder and misalignment beneath BGA, QFN, LGA and other bottom-terminated components. BGA rework equipment then provides controlled heating and optical alignment for component replacement.<\/div>\n<\/div>\n <\/div><\/div>\n\n\n\n
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Main SMT Equipment Categories<\/h2>\n\n\n\n
View dry ice cleaning machines, fixture cleaning machines, reflow ovens, DI-water systems and other supporting SMT equipment.<\/div>\n<\/div>\n\n\n\n
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View All SMT Equipment<\/span><\/span>\n <\/path>\n<\/svg><\/span><\/span><\/a><\/div>\n<\/div>\n <\/div><\/div>\n\n\n\n